Global BGA Package Substrate Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

Report ID: GIR2208120009 | Category: Electronics & Semiconductor | Pages: 129 | Format: PDF | Published Date: September 07,2022

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Report Summary

The BGA Package Substrate market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 and Russia-Ukraine War influence, the global BGA Package Substrate market size was valued at USD million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during review period.
The BGA Package Substrate market in the USA. is estimated at USD million in 2022, which currently accounts for a % share in the global market. China, the world`s second largest economy, is estimated at USD million in 2022 and holds a % percent.
MPU/CPU/Chipset occupied for % of the BGA Package Substrate global market in 2021, and it is projected to value USD million by 2028, growing at a % CAGR in next six years. In terms of product type, WB BGA segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of BGA Package Substrate include IBIDEN, SHINKO, SimmTech, Korea Circuit and SAMSUNG ELECTRO-MECHANICS, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Key Features of This Report:
This report provides in-depth analysis of the global BGA Package Substrate market, and provides market size (value, volume and average price) and CAGR for the history and forecast period (2017-2022, 2023-2028), considering 2021 as the base year
Main BGA Package Substrate manufacturers’ industry ranking, sales, revenue, price, and market share analysis. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This reports profiles key players in the global BGA Package Substrate market based on the following parameters – headquarters, production locations, products portfolio, BGA Package Substrate revenue, sales, average price and gross margin, recent developments.
Evaluation and forecast the BGA Package Substrate market size, projected growth trends, and corresponding market share analysis by type, by application, and by region. It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
Highlights of the current market scenario, recent information, latest developments, and factors impacting the growth of the market
Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
Market Segmentation
BGA Package Substrate market is split by Type and by Application. For the period 2017-2028, the growth among segments provides accurate calculations and forecasts for sales by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type (2017-2028; USD Million)
    WB BGA
    FC-BGA
Market segment by Application (2017-2028; USD Million)
    MPU/CPU/Chipset
    GPU and CPU
    ASIC/DSP Chip/FPGA
    Others
The key market players for global BGA Package Substrate market are listed below:
    IBIDEN
    SHINKO
    SimmTech
    Korea Circuit
    SAMSUNG ELECTRO-MECHANICS
    SEP Co ., Ltd
    Nan Ya PCB Corporation
    Siliconware Precision Industries
    LG Innotek
    TOPPAN INC
    Kyocera
    QP Technologies
    FICT Limited
    Shenzhen Hemeijingyi
    Zhen Ding Technology
    AT&S
    KINSUS
    Daeduck Electronics
    ASE Technology
    ACCESS
Region Segment (2017-2028; USD Million)
    North America (United States, Canada and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe BGA Package Substrate product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of BGA Package Substrate, with price, sales, revenue and global market share of BGA Package Substrate from 2019 to 2022.
Chapter 3, the BGA Package Substrate competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the BGA Package Substrate breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and BGA Package Substrate market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of BGA Package Substrate.
Chapter 13, 14, and 15, to describe BGA Package Substrate sales channel, distributors, customers, research findings and conclusion, appendix and data source.

1 Market Overview
    1.1 BGA Package Substrate Introduction
    1.2 Market Analysis by Type
        1.2.1 Overview: Global BGA Package Substrate Revenue by Type: 2017 Versus 2021 Versus 2028
        1.2.2 WB BGA
        1.2.3 FC-BGA
    1.3 Market Analysis by Application
        1.3.1 Overview: Global BGA Package Substrate Revenue by Application: 2017 Versus 2021 Versus 2028
        1.3.2 MPU/CPU/Chipset
        1.3.3 GPU and CPU
        1.3.4 ASIC/DSP Chip/FPGA
        1.3.5 Others
    1.4 Global BGA Package Substrate Market Size & Forecast
        1.4.1 Global BGA Package Substrate Sales in Value (2017 & 2021 & 2028)
        1.4.2 Global BGA Package Substrate Sales in Volume (2017-2028)
        1.4.3 Global BGA Package Substrate Price (2017-2028) 
    1.5 Global BGA Package Substrate Production Capacity Analysis
        1.5.1 Global BGA Package Substrate Total Production Capacity (2017-2028)
        1.5.2 Global BGA Package Substrate Production Capacity by Geographic Region
    1.6 Market Drivers, Restraints and Trends
        1.6.1 BGA Package Substrate Market Drivers
        1.6.2 BGA Package Substrate Market Restraints
        1.6.3 BGA Package Substrate Trends Analysis
2 Manufacturers Profiles
    2.1 IBIDEN
        2.1.1 IBIDEN Details
        2.1.2 IBIDEN Major Business
        2.1.3 IBIDEN BGA Package Substrate Product and Services
        2.1.4 IBIDEN BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.2 SHINKO
        2.2.1 SHINKO Details
        2.2.2 SHINKO Major Business
        2.2.3 SHINKO BGA Package Substrate Product and Services
        2.2.4 SHINKO BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.3 SimmTech
        2.3.1 SimmTech Details
        2.3.2 SimmTech Major Business
        2.3.3 SimmTech BGA Package Substrate Product and Services
        2.3.4 SimmTech BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.4 Korea Circuit
        2.4.1 Korea Circuit Details
        2.4.2 Korea Circuit Major Business
        2.4.3 Korea Circuit BGA Package Substrate Product and Services
        2.4.4 Korea Circuit BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.5 SAMSUNG ELECTRO-MECHANICS
        2.5.1 SAMSUNG ELECTRO-MECHANICS Details
        2.5.2 SAMSUNG ELECTRO-MECHANICS Major Business
        2.5.3 SAMSUNG ELECTRO-MECHANICS BGA Package Substrate Product and Services
        2.5.4 SAMSUNG ELECTRO-MECHANICS BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.6 SEP Co ., Ltd
        2.6.1 SEP Co ., Ltd Details
        2.6.2 SEP Co ., Ltd Major Business
        2.6.3 SEP Co ., Ltd BGA Package Substrate Product and Services
        2.6.4 SEP Co ., Ltd BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.7 Nan Ya PCB Corporation
        2.7.1 Nan Ya PCB Corporation Details
        2.7.2 Nan Ya PCB Corporation Major Business
        2.7.3 Nan Ya PCB Corporation BGA Package Substrate Product and Services
        2.7.4 Nan Ya PCB Corporation BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.8 Siliconware Precision Industries
        2.8.1 Siliconware Precision Industries Details
        2.8.2 Siliconware Precision Industries Major Business
        2.8.3 Siliconware Precision Industries BGA Package Substrate Product and Services
        2.8.4 Siliconware Precision Industries BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.9 LG Innotek
        2.9.1 LG Innotek Details
        2.9.2 LG Innotek Major Business
        2.9.3 LG Innotek BGA Package Substrate Product and Services
        2.9.4 LG Innotek BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.10 TOPPAN INC
        2.10.1 TOPPAN INC Details
        2.10.2 TOPPAN INC Major Business
        2.10.3 TOPPAN INC BGA Package Substrate Product and Services
        2.10.4 TOPPAN INC BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.11 Kyocera
        2.11.1 Kyocera Details
        2.11.2 Kyocera Major Business
        2.11.3 Kyocera BGA Package Substrate Product and Services
        2.11.4 Kyocera BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.12 QP Technologies
        2.12.1 QP Technologies Details
        2.12.2 QP Technologies Major Business
        2.12.3 QP Technologies BGA Package Substrate Product and Services
        2.12.4 QP Technologies BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.13 FICT Limited
        2.13.1 FICT Limited Details
        2.13.2 FICT Limited Major Business
        2.13.3 FICT Limited BGA Package Substrate Product and Services
        2.13.4 FICT Limited BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.14 Shenzhen Hemeijingyi
        2.14.1 Shenzhen Hemeijingyi Details
        2.14.2 Shenzhen Hemeijingyi Major Business
        2.14.3 Shenzhen Hemeijingyi BGA Package Substrate Product and Services
        2.14.4 Shenzhen Hemeijingyi BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.15 Zhen Ding Technology
        2.15.1 Zhen Ding Technology Details
        2.15.2 Zhen Ding Technology Major Business
        2.15.3 Zhen Ding Technology BGA Package Substrate Product and Services
        2.15.4 Zhen Ding Technology BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.16 AT&S
        2.16.1 AT&S Details
        2.16.2 AT&S Major Business
        2.16.3 AT&S BGA Package Substrate Product and Services
        2.16.4 AT&S BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.17 KINSUS
        2.17.1 KINSUS Details
        2.17.2 KINSUS Major Business
        2.17.3 KINSUS BGA Package Substrate Product and Services
        2.17.4 KINSUS BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.18 Daeduck Electronics
        2.18.1 Daeduck Electronics Details
        2.18.2 Daeduck Electronics Major Business
        2.18.3 Daeduck Electronics BGA Package Substrate Product and Services
        2.18.4 Daeduck Electronics BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.19 ASE Technology
        2.19.1 ASE Technology Details
        2.19.2 ASE Technology Major Business
        2.19.3 ASE Technology BGA Package Substrate Product and Services
        2.19.4 ASE Technology BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
    2.20 ACCESS
        2.20.1 ACCESS Details
        2.20.2 ACCESS Major Business
        2.20.3 ACCESS BGA Package Substrate Product and Services
        2.20.4 ACCESS BGA Package Substrate Sales, Price, Revenue, Gross Margin and Market Share (2019, 2020, 2021, and 2022)
3 BGA Package Substrate Breakdown Data by Manufacturer
    3.1 Global BGA Package Substrate Sales in Volume by Manufacturer (2019, 2020, 2021, and 2022)
    3.2 Global BGA Package Substrate Revenue by Manufacturer (2019, 2020, 2021, and 2022)
    3.3 Key Manufacturer Market Position in BGA Package Substrate
    3.4 Market Concentration Rate
        3.4.1 Top 3 BGA Package Substrate Manufacturer Market Share in 2021
        3.4.2 Top 6 BGA Package Substrate Manufacturer Market Share in 2021
    3.5 Global BGA Package Substrate Production Capacity by Company: 2021 VS 2022
    3.6 Manufacturer by Geography: Head Office and BGA Package Substrate Production Site
    3.7 New Entrant and Capacity Expansion Plans
    3.8 Mergers & Acquisitions
4 Market Analysis by Region
    4.1 Global BGA Package Substrate Market Size by Region
        4.1.1 Global BGA Package Substrate Sales in Volume by Region (2017-2028)
        4.1.2 Global BGA Package Substrate Revenue by Region (2017-2028)
    4.2 North America BGA Package Substrate Revenue (2017-2028)
    4.3 Europe BGA Package Substrate Revenue (2017-2028)
    4.4 Asia-Pacific BGA Package Substrate Revenue (2017-2028)
    4.5 South America BGA Package Substrate Revenue (2017-2028)
    4.6 Middle East and Africa BGA Package Substrate Revenue (2017-2028)
5 Market Segment by Type
    5.1 Global BGA Package Substrate Sales in Volume by Type (2017-2028)
    5.2 Global BGA Package Substrate Revenue by Type (2017-2028)
    5.3 Global BGA Package Substrate Price by Type (2017-2028)
6 Market Segment by Application
    6.1 Global BGA Package Substrate Sales in Volume by Application (2017-2028)
    6.2 Global BGA Package Substrate Revenue by Application (2017-2028)
    6.3 Global BGA Package Substrate Price by Application (2017-2028)
7 North America by Country, by Type, and by Application
    7.1 North America BGA Package Substrate Sales by Type (2017-2028)
    7.2 North America BGA Package Substrate Sales by Application (2017-2028)
    7.3 North America BGA Package Substrate Market Size by Country
        7.3.1 North America BGA Package Substrate Sales in Volume by Country (2017-2028)
        7.3.2 North America BGA Package Substrate Revenue by Country (2017-2028)
        7.3.3 United States Market Size and Forecast (2017-2028)
        7.3.4 Canada Market Size and Forecast (2017-2028)
        7.3.5 Mexico Market Size and Forecast (2017-2028)
8 Europe by Country, by Type, and by Application
    8.1 Europe BGA Package Substrate Sales by Type (2017-2028)
    8.2 Europe BGA Package Substrate Sales by Application (2017-2028)
    8.3 Europe BGA Package Substrate Market Size by Country
        8.3.1 Europe BGA Package Substrate Sales in Volume by Country (2017-2028)
        8.3.2 Europe BGA Package Substrate Revenue by Country (2017-2028)
        8.3.3 Germany Market Size and Forecast (2017-2028)
        8.3.4 France Market Size and Forecast (2017-2028)
        8.3.5 United Kingdom Market Size and Forecast (2017-2028)
        8.3.6 Russia Market Size and Forecast (2017-2028)
        8.3.7 Italy Market Size and Forecast (2017-2028)
9 Asia-Pacific by Region, by Type, and by Application
    9.1 Asia-Pacific BGA Package Substrate Sales by Type (2017-2028)
    9.2 Asia-Pacific BGA Package Substrate Sales by Application (2017-2028)
    9.3 Asia-Pacific BGA Package Substrate Market Size by Region
        9.3.1 Asia-Pacific BGA Package Substrate Sales in Volume by Region (2017-2028)
        9.3.2 Asia-Pacific BGA Package Substrate Revenue by Region (2017-2028)
        9.3.3 China Market Size and Forecast (2017-2028)
        9.3.4 Japan Market Size and Forecast (2017-2028)
        9.3.5 Korea Market Size and Forecast (2017-2028)
        9.3.6 India Market Size and Forecast (2017-2028)
        9.3.7 Southeast Asia Market Size and Forecast (2017-2028)
        9.3.8 Australia Market Size and Forecast (2017-2028)
10 South America by Region, by Type, and by Application
    10.1 South America BGA Package Substrate Sales by Type (2017-2028)
    10.2 South America BGA Package Substrate Sales by Application (2017-2028)
    10.3 South America BGA Package Substrate Market Size by Country
        10.3.1 South America BGA Package Substrate Sales in Volume by Country (2017-2028)
        10.3.2 South America BGA Package Substrate Revenue by Country (2017-2028)
        10.3.3 Brazil Market Size and Forecast (2017-2028)
        10.3.4 Argentina Market Size and Forecast (2017-2028)
11 Middle East & Africa by Country, by Type, and by Application
    11.1 Middle East & Africa BGA Package Substrate Sales by Type (2017-2028)
    11.2 Middle East & Africa BGA Package Substrate Sales by Application (2017-2028)
    11.3 Middle East & Africa BGA Package Substrate Market Size by Country
        11.3.1 Middle East & Africa BGA Package Substrate Sales in Volume by Country (2017-2028)
        11.3.2 Middle East & Africa BGA Package Substrate Revenue by Country (2017-2028)
        11.3.3 Turkey Market Size and Forecast (2017-2028)
        11.3.4 Egypt Market Size and Forecast (2017-2028)
        11.3.5 Saudi Arabia Market Size and Forecast (2017-2028)
        11.3.6 South Africa Market Size and Forecast (2017-2028)
12 Raw Material and Industry Chain
    12.1 Raw Material of BGA Package Substrate and Key Manufacturers
    12.2 Manufacturing Costs Percentage of BGA Package Substrate
    12.3 BGA Package Substrate Production Process
    12.4 BGA Package Substrate Industrial Chain
13 Sales Channel, Distributors, Traders and Dealers
    13.1 Sales Channel
        13.1.1 Direct Marketing
        13.1.2 Indirect Marketing
    13.2 BGA Package Substrate Typical Distributors
    13.3 BGA Package Substrate Typical Customers
14 Research Findings and Conclusion
15 Appendix
    15.1 Methodology
    15.2 Research Process and Data Source
    15.3 Disclaimer

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Global BGA Package Substrate Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

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